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內容簡介：
? 電子封裝簡介Brief introduction of electronic package
? 失效定義及分類Definition and classification of failures
? 電子產品為何失效Why do electronic products fail?
? 失效分析的目標The objectives of failure analysis
? 失效分析的重要性Understand the importance of failure analysis
? 失效分析的思想方法Philosophical approach of failure analysis
? 失效分析技術線路Technique approach of failure analysis
? 失效分析流程Failure analysis flow charts
? 元器件典型失效模式和機理Typical failure modes and failure mechanisms of electronics components
? 產品可靠性浴盆曲線Product reliability and bathtub curve
? 篩選試驗，可靠性試驗，可靠性認證Screening tests, reliability tests, qualification tests
? 常見可靠性試驗、目的、誘導的典型失效模式及機理等Common reliability tests, objectives, typical failure modes and mechanisms
? 典型集成電路塑料封裝器件的封裝認證標準簡介Typical standards on package qualification of plastic packaged ICs
? 器件結構分析Package construction analysis
? 塑料封裝器件中的水汽擴散、回流焊接過程中濕氣蒸發引起的分層、爆裂等失效現象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
? 器件濕氣敏感性分級：JESD020C:非氣密性表面封裝固態電路的水汽/回流敏感性等級 Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
? 如何判斷與濕氣敏感性相關的失效的根本原因：器件質量還是電子組裝？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
? 器件懷疑吸濕如何處理：實用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
? 焊接界面形成 Solidification and interface intermetallics formation
? 電子產品服役過程中焊料組織及界面金屬間化合物的演化及其與焊點失效的關系 Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime
? 影響焊點壽命的典型設計、工藝、材料等因素 Typical design, material, process parameters affecting soldering joint lifetime
? 焊點失效分析流程 Typical flow chart for solder joint failure analysis
? 焊點失效典型模式及分析方法 Typical failure modes and analy
