課程內容：
模塊一 ﹡概述/如何建立和保持認證課程政策和程序/Summarize/policy and program。
（關于認證課程、證書的期限、參與者的義務、IPC認證培訓員、補考的政策等/About authentication course\ Time limit of the certificate\ The participant's obligation etc.。）
模塊二 ﹡前言、可適用文件、操作/Foreword/ Applicable Documents/ Handling Electronic Assemblies
(范圍、目的、特殊設計、術語和定義、圖例、檢查方法、尺寸界定、放大裝置和照明、適用文件、IPC文件、電子組件操作等。Scope/ Purpose/ Specialized Designs/ Terms & Defintions/ Examples and lllustrations/ Inspection Methodology/ Verification of Dimensions / Magnification Aid and Lighting/ IPC Documents/ Handling Electronic Assemblies etc.?)
模塊三 ﹡機械裝聯/Hardware
(機械零件的安裝、連接器、拔插件、手柄和插孔、連接器引腳、線束固定、布線等。Hardware Installation/ Connectors,Handles,Extractors,Latches/Connector Pins/ Wire Bundle Securing/Routing etc.)
模塊四 ﹡焊接和高電壓Soldering/ High Voltage
(焊接的可接受性、高壓以及焊接異常等Soldering Acceptability Requirements/ Soldering Anomalies/ High Voltage—Terminals/Solder Cups/Insulation/Throgh-hole Connections/Flared Flange Terminals/Other Hardware.)
模塊五 ﹡端子連接Terminal Connections
(夾簧鉚接端、鉚接件、導線/引腳準備上錫、引腳成型-應力釋放、維修環、應力釋放引腳/導線彎曲、引腳/導線的安放、絕緣皮、導體、端子焊接、導體-損傷-焊后的情形等。Edge Clip/ Swaged Hardware/ Wire/lead Preparation-tining/Lead Forming-Stress Relief/Service loops/ Terminals-stress Relief lead/Wire Bend/ Lead/Wire Placement/Insulation/Conductor/Terminals-Solder/Conductor-Damage-Posrt-Solder)
模塊六 ﹡通孔連接技術Througe-hole Technology
(元氣件安放、散熱器、元氣件緊固、支撐孔、非支撐孔、跨接線等。Component Mounting/ Heatsinks/ Component Securing / Unsupported Holes / Supported Holes / Jumper Wires.)
模塊七 ﹡表面安裝技術Surface Mount Assembiles
（膠水粘接、SMT連接（底部焊墊片式元件、1-3-5片式元件、圓拄型、城堡型、鷗翼型引腳、圓形或扁圓型引腳、J型、I型、扁平焊片、高立底部焊墊、內L型、BGA、PQFN等引腳形態）、跨接線等。Staking Adhesive / SMT Connections( Chip Componts-Bottom Only Terminations / Chip Components-Rectangular or Square End Components-1,3 or 5 Side Termination / Cylindrical End Cap(MELF) Termination / Castellated Terminations / Flat Ribbon, L, and Gull Wing Leads / Round or Flattened (coined) Leads / J leads / Butt/ I Connections / Flat Lug Leads / Tall Profile Components Having Bottom Only Terminations / Inward Formed L-Shaped Ribbon Leads / Surface Mount Area Array / Plastic Quad Flat Pack-No Leads(PQFN) / Components with Bottom Thermal Plane Terminations.) / Jumper Wires.）
模塊八 *元件損傷和印制電路板及其組件Component Damage / Printed Circuit Boards and Assemblies
（印制電路板和組件（金手指、層壓板狀況、導體和焊盤、標記、清潔度、涂覆）、元件的損傷等。Component Damage / Printed Circuit Boards and Assemblies(Gold Fingers / Laminate Conditions / Marking / Cleanliness / Coatings )）
模塊九 *分立連接導線的可接受性要求Discrete Wiring Acceptability Requirements
（無焊饒接、匝數、匝間隙、導線尾端/帶絕緣段饒匝、線匝隆起、聯接位置、埋線、饒線松緊度、鍍層、絕緣皮損傷、導線和接線柱損傷等的判定。Solderless Wrap ( Number Wrap / Turn Spacing / End Tails,Insulation Wrap / Raised Tums Overlap / Connection Positon / Wire Dress / Wire Slack / Wire Plating / Damaged Insulation / Damaged Conductors & Terminals)）
模塊十 *考試Testing
（開卷和閉卷Open testing and Close testing.）
